EPO-TEK® OM125
Optical Epoxy Adhesive
Two component, high Tg optical epoxy designed for bonding multi-mode fiber optic connectors.
EPO-TEK® P10
Silver Die Attach Polyimide
A single component, modified polyimide, high-temperature grade, silver-filled, electrically and thermally conductive adhesive designed for semiconductor die attach and hybrid microelectronic packaging.
EPO-TEK® P1011-2
SIlver Chip Bonding Polyimide
Single component, modified polyimide, silver-filled adhesive designed for chip bonding in microelectronics and optoelectronic applications.
EPO-TEK® P1011-T2
Die Attach Polyimide
Electrically conductive, modified polyimide adhesive designed for die-attach of semiconductors and hybrid IC packaging.
EPO-TEK® P1011S-2
Silver Die Attach Polyimide
Single component, modified polyimide, high temperature grade, silver-filled electrically conductive and thermally conductive adhesive designed for semiconductor die-attached and hybrid microelectronic packaging.
EPO-TEK® P1011ST-2
Silver Die Attach Polyimide
Single component, modified polyimide, high temperature grade, silver-filled electrically conductive and thermally conductive adhesive designed for semiconductor die-attached and hybrid microelectronic packaging. It is a lower viscosity version of P1011-T2.
EPO-TEK® T-7
Thermally Conductive Epoxy
Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in semiconductor, microelectronic, optoelectronics, and general electronic assembly applications. It can be used at the chip or PCB packaging level interconnect.
EPO-TEK® T606-3
Thermally Conductive Epoxy
Single component thermally conductive epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging. It is a lower viscosity version of EPO-TEK® T6067.
EPO-TEK® T7109
Thermal Heatsink Adhesive
Thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid microelectronics, and optical industries.
