EPO-TEK® EE178-9
Electrically Conductive Adhesive
A two component, electrically conductive epoxy adhesive designed for semiconductor, hybrid, PCB and optoelectronic assemblies. It was designed for precision dispensing or stamping of small dot arrays, in ultra fine pitch applications such as connectors to flex-PCB, SMD...
EPO-TEK® EK1000
Electrically Conductive Silver Filled Adhesive
High thermal conductive silver filled adhesive.
EPO-TEK® EM127
Electrically Conductive Adhesive
Single component, heat curable, electrically conductive epoxy adhesive for semiconductor IC and LED die attach applications.
EPO-TEK® GD2191
Thermally Conductive Epoxy
Two component, thermally conductive, electrically insulating epoxy with long pot life and adhesion to stainless steel.
EPO-TEK® GE120
Nonconductive Adhesive
Single component, thixotropic, electrically and thermally insulating epoxy adhesive designed for bonding SMDs to PCBs. It can be used for electronic assembly in many devices including consumer electronics, cell phone, telecommunications, automotive, and scientific/OEM.
EPO-TEK® H20E-175
Electrically Conductive Adhesive
Two component epoxy designed for semiconductor die-attach. It is a higher Tg version of EPO-TEK® H20E. It was designed to be used in semiconductor/JEDEC packaging, microelectronic packaging of hybrids, as well as high temperature devices and assembly.
EPO-TEK® H20E-8
Electrically Conductive Adhesive
Two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a higher viscosity and higher thixotropic version of EPO-TEK® H20E.
EPO-TEK® H20E-D
Electrically Conductive Adhesive
Single component, 100% solids, silver-filed epoxy designed for electrically and thermally conductive bonds. It is an enhanced version of EPO-TEK® H20E.
EPO-TEK® H20E-LC
Electrically Conductive Adhesive
EPO-TEK® H20E-LC is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. It has proven itself...
