EPO-TEK® OG198-55
Biocompatible UV Curing Epoxy
Shadow Curable UV Epoxy. Thixotropic version of EPO-TEK® OG198-54.
EPO-TEK® OG603
Acrylate-Based UV Cure
This all-purpose general adhesive is a single-component, low viscosity, UV-curable formula that cures in seconds for optical applications, medical uses, and PCB-level electro-optics. It is also suitable for sealing and coating applications.
EPO-TEK® OG653
Acrylate-Based UV Cure
UV curable adhesive designed for glob top encapsulation.
EPO-TEK® OG675
Acrylate-Based UV Cure
A UV fast-curing, flexible adhesive with medium viscosity and optical clarity.
EPO-TEK® T7109
Thermal Heatsink Adhesive
Thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid microelectronics, and optical industries.
EPO-TEK® T7110
Thermally Conductive Electrically Insulating Epoxy
Thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such as consumer or optics.
EPO-TEK® TJ2139-LH Black
Thermally Conductive Epoxy
This two component epoxy is low-halogen, electrically insulating die attach adhesive with long pot life.
EPO-TEK® TZ101
Thermally Conductive Adhesive
Single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics.
EPO-TEK® U300-22
Optically Clear Epoxy
This epoxy offers a long pot-life, high Tg, and optical clarity are a few of its traits. NASA approved low outgassing epoxy suitable for electronic applications such as smart cards, RFIDs, and wafer level camera optics.
