20-3305
Thermal Shock Resistance Epoxy
Low viscosity thermal shock epoxy with a Dielectric Strength of 1857 V/mil.
50-3112
Fast Curing Epoxy Adhesive
Fast curing epoxy adhesive with high lap shear strength available in the convenient TriggerBond® packaging.
50-3141FR
Flame Retardant Epoxy Adhesive
Fast curing, flame retardant epoxy adhesive that meets UL 94 V-0 requirements. 2:1 mix ratio available in dual barrel TriggerBond cartridges and in bulk packaging.
50-3150RFRBK
Electrically Insulating Epoxy
UL 94 V-0 listed potting epoxy with excellent electrical insulation properties with 5 different catalyst options. CAT.12, CAT.30, and CAT.190 provide a wide range of mix viscosity options. CAT.150 and CAT.154 available for a low mix viscosity with...
EPO-TEK® 301
Low Viscosity Optical Grade Epoxy
Room temperature curing epoxy featuring very low viscosity, clear and excellence optical-mechanical properties.
EPO-TEK® B9101-2 Unfilled
Nonconductive Adhesive
Single component, electrically and thermally insulating epoxy designed for adhesive, sealing, and potting of micro-electronics and semiconductor devices. Maybe used in industries such as military, automotive, optical, or medical electronics.
EPO-TEK® EK1000-MP
Silver Conductive Epoxy
A single-component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity, along with a shiny silver appearance, making it ideal for the demanding requirements of high-power LED die attach applications.
EPO-TEK® H20E-MP
Electrically Conductive Silver Epoxy
Low outgassing silver epoxy meeting MIL-STD 883 /5011 and NASA ASTM E595.
EPO-TEK® H21D
High Tg Silver Epoxy
High glass transition temperature silver epoxy designed for chip bonding in microelectronic and optoelectronic applications.
