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46 matches
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50-3141

50-3141

Flame Retardant Epoxy Adhesive

Fast curing, flame retardant epoxy adhesive that meets UL 94 V-0 requirements. 2:! mix ratio available in dual barrel TriggerBond cartridges and in bulk packaging.

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50-3150RFRBK

50-3150RFRBK

Electrically Insulating Epoxy

UL 94 V-0 listed potting epoxy with excellent electrical insulation properties with 5 different catalyst options. CAT.12, CAT.30, and CAT.190 provide a wide range of mix viscosity options. CAT.150 and CAT.154 available for a low mix viscosity with...

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EPO-TEK® 301

EPO-TEK® 301

Low Viscosity Optical Grade Epoxy

Room temperature curing epoxy featuring very low viscosity, clear and excellence optical-mechanical properties.

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EPO-TEK® 353ND

EPO-TEK® 353ND

Low Outgassing Optical Epoxy

High Temperature  Resistance & Low outgassing Epoxy Meeting NASA ASTM E595 & Telcordia GR-1221.

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EPO-TEK® 377H

EPO-TEK® 377H

Graphite Filled Bonding Epoxy

Graphite-filled, High Temperature Epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer, military, and optical/OEM /fiber optics. It is an electrically conductive version of EPO-TEK® 377.

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EPO-TEK® EK1000-MP

Silver Conductive Epoxy

A single-component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity, along with a shiny silver appearance, making it ideal for the demanding requirements of high-power LED die attach applications.

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EPO-TEK® H20E

EPO-TEK® H20E

Silver Filled Electrically Conductive Epoxy

100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.

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EPO-TEK® H20E-MP

EPO-TEK® H20E-MP

Electrically Conductive Silver Epoxy

Low outgassing silver epoxy meeting MIL-STD 883 /5011 and NASA ASTM E595.

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EPO-TEK® H21D

EPO-TEK® H21D

High Tg Silver Epoxy

High glass transition temperature silver epoxy designed for chip bonding in microelectronic and optoelectronic applications. 

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