EPO-TEKĀ® HYB-353ND
UV Hybrid
A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications. It is designed to have similar cured performance to EPO-TEKĀ® 353ND; modified to allow for initial UV tacking.
EPO-TEKĀ® HYB-353ND-HV
UV Hybrid Curing Epoxy
A single component, high temperature epoxy for semiconductor, hybrid, and fiber optic applications. It is designed to have similar cured performance to EPO-TEKĀ® 353ND; modified to allow for initial UV tacking. It is a higher viscosity version of...
EPO-TEKĀ® HYB-353ND-LV
Low Viscosity UV Hybrid Epoxy
A single component, high temperature hybrid epoxy for semiconductor and fiber optic applications. It is designed to have similar cured performance to EPO-TEKĀ® 353ND; modified to allow for initial UV tacking. It is a lower viscosity version of...
EPO-TEKĀ® HYB-353ND-TX2
UV Hybrid Epoxy
A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications.
EPO-TEKĀ® OG142-112LH
UV Curable Epoxy Adhesive
Low halogen version of OG142-112, single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging applications.
EPO-TEKĀ® OG142-87
Fiber Optic Epoxy Adhesive
Single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging application.
EPO-TEKĀ® OG198-54
UV Curable Epoxy
Single component, low viscosity, electrically and thermally insulating shadow curable UV epoxy.
EPO-TEKĀ® OG198-55
Biocompatible UV Curing Epoxy
Shadow Curable UV Epoxy. Thixotropic version of EPO-TEKĀ® OG198-54.
EPO-TEKĀ® T7110
Thermally Conductive Electrically Insulating Epoxy
Thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such as consumer or optics.
