EPO-TEK® OE188
High Temperature, Low CTE Epoxy
Two component, high Tg, low CTE epoxy designed for adhesive and sealing applications within the semiconductor and fiber optic industries.
EPO-TEK® OE188-3
Low CTE Epoxy
Two component, high Tg, low CTE epoxy designed for adhesive and sealing applications within the semiconductor, hybrid, sensor device, and fiber industries.
EPO-TEK® OG116-31
UV Epoxy Encapsulant
Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.
EPO-TEK® OG142
UV & UV Hybrid
Single component, UV curable epoxy designed for adhesive, sealing, and encapsulating applications found in semiconductor, electro-optics, fiber optics, medica, and scientific/OEM industries.
EPO-TEK® OG142-112
UV Cure Optical Epoxy
This single component, low viscosity epoxy is designed for adhesive sealing and encasulating fiber optic and opto-clectronic packaging applications.
EPO-TEK® OG142-112LH
UV Curable Epoxy Adhesive
Low halogen version of OG142-112, single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging applications.
EPO-TEK® OG142-87
Fiber Optic Epoxy Adhesive
Single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging application.
EPO-TEK® OG148
UV & UV Hybrid
Single component, UV curable epoxy designed for adhesive, sealing, and encapsulating applications found in semiconductor, electro-optics, fiber optics, medical, and scientific/OEM industries. It is a clear, high Tg epoxy.
EPO-TEK® OG198-54
UV Curable Epoxy
Single component, low viscosity, electrically and thermally insulating shadow curable UV epoxy.
