Features
- Ease of use: long pot-life with low temperature cure of 80°C possible.
- Formulated with a very fine boron-nitride filler particle
- Passes NASA low outgassing standard ASTM E595 with proper cure
Applications
- Recommended for applications where heat dissipation and insulating properties are essential; attaching heat sinks on PCB; heat-sinking in hybrids such as DIP or TO-cans; kovar, aluminum or ceramic packaging.
- Semiconductor applications: die-attach inside plastic IC packages using JEDEC format; die bonding power devices; thermally conductive underfill and glob top for flip-chip assembled die.
Available Packaging
Please call the technical team at
1-978-667-3805 to discuss packaging options.
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Get in touch to learn more
Speak to us on 1-978-667-3805
Contact usEPO-TEK® 930-4
Thermally Conductive AdhesiveLet's talk
We're here to help you create the perfect product.