Features
- Ease of use: long pot-life with low temperature cure of 80°C possible.
- Formulated with a very fine boron-nitride filler particle
- Passes NASA low outgassing standard ASTM E595 with proper cure
Applications
- Recommended for applications where heat dissipation and insulating properties are essential; attaching heat sinks on PCB; heat-sinking in hybrids such as DIP or TO-cans; kovar, aluminum or ceramic packaging.
- Semiconductor applications: die-attach inside plastic IC packages using JEDEC format; die bonding power devices; thermally conductive underfill and glob top for flip-chip assembled die.
Available Packaging
Please call the technical team at
1-978-667-3805 to discuss packaging options.

Related Products

EPO-TEK® EK1000
Electrically Conductive Silver Filled Adhesive
High thermal conductive silver filled adhesive.

EPO-TEK® 323LP
High Temperature Optical Epoxy
Long pot life, high temperature epoxy designed for semiconductor, hybrid, fiber, and optical applications. Fiber optic adhesive designed to meet Telecordia 1221.
EPO-TEK® H65-175MP
Thermally Conductive Epoxy
EPO-TEK® H65-175MP is a single component, alumina-filled epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vauum packaging.

EPO-TEK® 353ND-T
Thixotropic Optical Epoxy Adhesive
Highly thixotropic epoxy with non-flowing properties and high temperature resistance.

EPO-TEK® OG198-54
UV Curable Epoxy
Single component, low viscosity, electrically and thermally insulating shadow curable UV epoxy.

20-3060
Impact Resistant Epoxy
Low viscosity epoxy with excellent impact and vibration resistance and improved chemical resistance. May be paired with 3 different catalysts.
EPO-TEK® EK1000
Electrically Conductive Silver Filled Adhesive
High thermal conductive silver filled adhesive.
EPO-TEK® 323LP
High Temperature Optical Epoxy
Long pot life, high temperature epoxy designed for semiconductor, hybrid, fiber, and optical applications. Fiber optic adhesive designed to meet Telecordia 1221.
EPO-TEK® H65-175MP
Thermally Conductive Epoxy
EPO-TEK® H65-175MP is a single component, alumina-filled epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vauum packaging.
EPO-TEK® 353ND-T
Thixotropic Optical Epoxy Adhesive
Highly thixotropic epoxy with non-flowing properties and high temperature resistance.
EPO-TEK® OG198-54
UV Curable Epoxy
Single component, low viscosity, electrically and thermally insulating shadow curable UV epoxy.
20-3060
Impact Resistant Epoxy
Low viscosity epoxy with excellent impact and vibration resistance and improved chemical resistance. May be paired with 3 different catalysts.


Get in touch to learn more
Speak to us on 1-978-667-3805
Contact us
EPO-TEK® 930-4
Thermally Conductive Epoxy AdhesiveLet's talk
We're here to help you create the perfect product.

















