Features
- Heat-sinking adhesive
- Excellent handling characteristics and the long pot life at room temperature for this unique, two component system is obtained without the use of solvents.
- Can be cured very rapidly; excellent material to use for making fast circuit repairs; can be snap-cured for in-line semiconductor die-bonding.
- Can be screen printed, machine dispensed, and stamped
Applications
- Chip bonding in microelectronic and optoelectronics applications.
- Fast circuit repairs
- Snap-cured for in-line semiconductor die-bonding
Available Packaging
Please call the technical team at
1-978-667-3805 to discuss packaging options.

Related Products

10-3005 Series
High Strength Bonding Epoxy
5-minute set, high bond strength epoxy ideal for on field repairs. Also available in high viscosity (HV) and non-sag (NS) versions. Related products include the 10-3020 series (20 minute set) and the 10-3046 series (46 minute set).

10-2055 Series
Thixotropic Adhesive for High CTE Substrates
General purpose, semi flexible thixotropic adhesives for high CTEsubstrates available in either a light or heavy paste.

EPO-TEK® HYB-353ND-HV
UV Hybrid Curing Epoxy
A single component, high temperature epoxy for semiconductor, hybrid, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a higher viscosity version of...

EPO-TEK® 353ND-T
Thixotropic Optical Epoxy Adhesive
Highly thixotropic epoxy with non-flowing properties and high temperature resistance.

EPO-TEK® 353NDP
PROPEL FORWARD WITH EPO-TEK® 353NDP
Meet the next generation of high-performance solutions. EPO-TEK® 353NDP takes reliability, durability, and efficiency to unprecedented levels—crafted for the challenges of the AI and Machine Learning era, and critical industries like Datacom & Telecom, Defense, Aerospace, and Automotive. ...

EPO-TEK® HYB-353ND-LV
Low Viscosity UV Hybrid Epoxy
A single component, high temperature hybrid epoxy for semiconductor and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a lower viscosity version of...
10-3005 Series
High Strength Bonding Epoxy
5-minute set, high bond strength epoxy ideal for on field repairs. Also available in high viscosity (HV) and non-sag (NS) versions. Related products include the 10-3020 series (20 minute set) and the 10-3046 series (46 minute set).
10-2055 Series
Thixotropic Adhesive for High CTE Substrates
General purpose, semi flexible thixotropic adhesives for high CTEsubstrates available in either a light or heavy paste.
EPO-TEK® HYB-353ND-HV
UV Hybrid Curing Epoxy
A single component, high temperature epoxy for semiconductor, hybrid, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a higher viscosity version of...
EPO-TEK® 353ND-T
Thixotropic Optical Epoxy Adhesive
Highly thixotropic epoxy with non-flowing properties and high temperature resistance.
EPO-TEK® 353NDP
PROPEL FORWARD WITH EPO-TEK® 353NDP
Meet the next generation of high-performance solutions. EPO-TEK® 353NDP takes reliability, durability, and efficiency to unprecedented levels—crafted for the challenges of the AI and Machine Learning era, and critical industries like Datacom & Telecom, Defense, Aerospace, and Automotive. ...
EPO-TEK® HYB-353ND-LV
Low Viscosity UV Hybrid Epoxy
A single component, high temperature hybrid epoxy for semiconductor and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a lower viscosity version of...


Get in touch to learn more
Speak to us on 1-978-667-3805
Contact us
EPO-TEK® H70S
Thermally Conductive EpoxyLet's talk
We're here to help you create the perfect product.

















