20-3300
High Temperature & Thermal Shock Epoxy
20-3300 is a two part epoxy system formulated to meet the most critical electronic encapsulating requirements. This system has low shrinkage, high tensile and compressive strength.
20-3302
Ultra Clear Epoxy Resin for Adhesives & Sealants
Ultra clear epoxy with an RI of 1.523 at 589 nm. High purity grade polymer system with a bubble free and glass smooth finish. Available as lower viscosity version 20-3302NCLV.
20-3305
Thermal Shock Resistance Epoxy
Low viscosity thermal shock epoxy with a Dielectric Strength of 1857 V/mil.
20-3401
Medical, Optical & Semiconductor Grade Epoxy Resin
20-3401 is a two component clear epoxy resin system. It provides excellent optical transmission properties along with outstanding adhesion and electrical insulation.
20-3650
Epoxy Potting & Encapsulating Compound
20-3650 is an easy to use, one to one ratio, electronic grade epoxy potting, casting, and encapsulating system.
20-3652
Potting & Encapsulating Epoxy
20-3652 is a filled epoxy casting, potting, and encapsulating resin system. This system exhibits excellent physical, thermal, and electrical insulation properties.
20-365240
Epoxy Potting & Encapsulating Compound
20-3652-40 is a filled epoxy casting, potting, and encapsulating resin system. This is a lower viscosity version of the 20-3652.
20-3660
High Temperature Epoxy Potting Compound
20-3660 is an electronic grade, 100% solids, epoxy resin system. In addition to its high temperature resistance, 20-3660 also provides outstanding physical properties at elevated temperatures.
30-3711
One Component Epoxy Coating
30-3711 is designed for coating and impregnating applications. It has excellent dielectric strength.
