20-3036
Low Density Epoxy Syntactic Foam
20 3036 is a lightweight epoxy for potting, casting, and encapsulating electronic components and assemblies. It is formulated in a convenient 2:1 by weight mix ratio
20-3037
Low Density Epoxy Adhesive & Sealant
20-3037 is a low density, two component epoxy bonding and sealing system. The 20-3037 is less than half the weight of most commercially available potting compounds.
20-3038
Low Density Syntactic Foam Epoxy
20-3038 is a lightweight epoxy for potting, casting, and encapsulating electronic components and assemblies.
20-3060
Impact Resistant Epoxy
Low viscosity epoxy with excellent impact and vibration resistance and improved chemical resistance. May be paired with 3 different catalysts.
20-3063
Epoxy Potting & Encapsulating Compound
20-3063 is an electronic grade potting and encapsulating compound. This epoxy system is designed for applications requiring an easy and affordable potting process.
20-3064
Flexible Epoxy Potting Compound & Adhesive
20-3064 NC is a filled Epoxy Resin System engineered to give the end user the ability to control the hardness of the cured casting. By varying the mix ratio, the hardness can be varied from 60 Shore A...
20-3065
Low Viscosity Potting & Encapsulating Resin
20-3065 NC is a general purpose, low viscosity epoxy potting and encapsulating resin system.
20-3068
Epoxy Adhesive & Potting Compound
20-3068 is a room temperature curing, two component, epoxy potting compound and adhesive. This product provides good water resistance, adhesion, and toughness.
20-3072
Epoxy Adhesive & Potting Compound
20-3072 is a room temperature curing, two component, epoxy potting compound and adhesive. Both the 20-3072 and 20-3072LV (low viscosity version of 20-3072) provide good water resistance, adhesion, and toughness.
