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50-3107

Low Viscosity Epoxy Potting Compound

50-3107 is a two-component potting and encapsulating compound. This system is designed to be self-extinguishing and meets the stringent requirements of UL 94-V0. 50-3107 is thermally conductive and is RoHS compliant. 

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50-3112

Fast Curing Epoxy Adhesive

Fast curing epoxy adhesive with high lap shear strength available in the convenient TriggerBond® packaging.

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50-3116

Thermally Conductive Flexible Epoxy Resin

50-3116 thermally conductive flexible epoxy formulation is designed for applications that require low stress during cure and electrical insulation. 

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50-3120

One Component Thermally Conductive Epoxy

50-3120 is a filled, single component, thermally conductive, electrically insulating epoxy system. This material is thixotropic and designed for the placement of SMD's on printed circuit boards or other substrates prior to wave soldering. It may also be...

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50-3122

One Component Thermally Conductive & Electrically Insulating Epoxy Adhesive

50-3122 is a one component epoxy adhesive with a unique combination of physical properties. 50-3122 passes NASA’s outgassing requirements per ASTM E595-07. 50-3122 is both a thermally conductive and electrically insulating epoxy adhesive. It is suitable for electronic,...

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50-3141FR

Flame Retardant Epoxy Adhesive

Fast curing, flame retardant epoxy adhesive that meets UL 94 V-0 requirements. 2:1 mix ratio available in dual barrel TriggerBond cartridges and in bulk packaging.

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50-3150RFRBK

Electrically Insulating Epoxy

UL 94 V-0 listed potting epoxy with excellent electrical insulation properties with 5 different catalyst options. CAT.12, CAT.30, and CAT.190 provide a wide range of mix viscosity options. CAT.150 and CAT.154 available for a low mix viscosity with...

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50-3151

Flame Retardant Thermally Conductive Epoxy Resin

50-3151NCFR has been formulated to meet the stringent non-burning requirements of UL 94 V-0. This system offers excellent heat transfer, low shrinkage, and outstanding insulation properties. 50-3151NCFR is low in viscosity and therefore offers outstanding flow around components. 

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50-3152FR

Thermally Conductive Potting Epoxy

Potting and encapsulating UL 94 V-0 listed epoxy with a CTI > 600 Volts. UL File Number E235584.