20-3074
Epoxy Potting Compound
20-3074NC is a low viscosity epoxy potting compound. This material forms excellent bonds to most substrates, has a convenient 1:1 mix ratio and a low exothermic reaction during cure.
20-3221
Low Viscosity Potting and Encapsulating Resin
20-3221 is a very low viscosity epoxy potting, casting and encapsulating resin system. It is a filled system resulting in excellent dimensional stability and low shrinkage.
20-3237
Flexible Epoxy Potting Compound
20-3237 is a new 1:1 ratio, low viscosity Epoxy Rubber System designed for potting delicate electronic components requiring inspection.
20-3238
Water Clear Optical Grade Epoxy
20-3238 is a two-component high purity grade polymer epoxy system. Its low viscosity is ideal for filling small cavities.
20-3241
Flexible Epoxy Resin Potting & Encapsulating Compound
This is a low viscosity formulation designed for encapsulation where a low embedment stress to sensitive electronic components is required
20-3242FR
Flame Retardant Non-Thermally Conductive Epoxy Resin
20-3242FR is a two-component potting and encapsulating epoxy. This product has excellent electrical insulation properties and moisture resistance.
20-3290
Potting, Encapsulating & Casting Epoxy Resin
20-3290 is a high temperature two-part epoxy system. This system has low coefficient of thermal expansion, good thermal shock resistance and high temperature service.
20-3300
High Temperature & Thermal Shock Epoxy
20-3300 is a two part epoxy system formulated to meet the most critical electronic encapsulating requirements. This system has low shrinkage, high tensile and compressive strength.
20-3302
Ultra Clear Epoxy Resin for Adhesives & Sealants
Ultra clear epoxy with an RI of 1.523 at 589 nm. High purity grade polymer system with a bubble free and glass smooth finish. Available as lower viscosity version 20-3302NCLV.
