20-3068
Epoxy Adhesive & Potting Compound
20-3068 is a room temperature curing, two component, epoxy potting compound and adhesive. This product provides good water resistance, adhesion, and toughness.
20-3072
Epoxy Adhesive & Potting Compound
20-3072 is a room temperature curing, two component, epoxy potting compound and adhesive. Both the 20-3072 and 20-3072LV (low viscosity version of 20-3072) provide good water resistance, adhesion, and toughness.
20-3074
Epoxy Potting Compound
20-3074NC is a low viscosity epoxy potting compound. This material forms excellent bonds to most substrates, has a convenient 1:1 mix ratio and a low exothermic reaction during cure.
20-3221
Low Viscosity Potting and Encapsulating Resin
20-3221 is a very low viscosity epoxy potting, casting and encapsulating resin system. It is a filled system resulting in excellent dimensional stability and low shrinkage.
20-3237
Flexible Epoxy Potting Compound
20-3237 is a new 1:1 ratio, low viscosity Epoxy Rubber System designed for potting delicate electronic components requiring inspection.
20-3238
Water Clear Optical Grade Epoxy
20-3238 is a two-component high purity grade polymer epoxy system. Its low viscosity is ideal for filling small cavities.
20-3241
Flexible Epoxy Resin Potting & Encapsulating Compound
This is a low viscosity formulation designed for encapsulation where a low embedment stress to sensitive electronic components is required
20-3242FR
Flame Retardant Non-Thermally Conductive Epoxy Resin
20-3242FR is a two-component potting and encapsulating epoxy. This product has excellent electrical insulation properties and moisture resistance.
20-3290
Potting, Encapsulating & Casting Epoxy Resin
20-3290 is a high temperature two-part epoxy system. This system has low coefficient of thermal expansion, good thermal shock resistance and high temperature service.
