EPO-TEK® OG198-55
Biocompatible UV Curing Epoxy
Shadow Curable UV Epoxy. Thixotropic version of EPO-TEK® OG198-54.
EPO-TEK® OG198-55-1
UV & UV Hybrid
High viscosity, single component, electrically and thermally insulating UV cure epoxy. It is a thixotropic version of EPO-TEK® OG198-54.
EPO-TEK® OG198-55HV
UV & UV Hybrid
High viscosity, single component, electrically and thermally insulating UV cure epoxy. It is a higher viscosity version of EPO-TEK® OG198-55.
EPO-TEK® OG198-763
UV & UV Hybrid
Medium viscosity, single component, electrically and thermally insulating, translucent UV cure epoxy. It is an intermediate rheology between EPO-TEK® OG198-54 and EPO-TEK® OG198-55.
EPO-TEK® OJ2933-LH
Nonconductive Adhesive
Low halogen snap curable thixotropic longer pot life version of EPO-TEK® 353ND.
EPO-TEK® OM118
Nonconductive Epoxy Adhesive
Two component, optically clear, electrically and thermally insulating epoxy designed for adhesive, sealing, and encapsulation applications found in semiconductor, medical, filtration, and scientific/OEM industries. It is a slightly higher viscosity and Tg alternative to EPO-TEK® 301.
EPO-TEK® P10
Silver Die Attach Polyimide
A single component, modified polyimide, high-temperature grade, silver-filled, electrically and thermally conductive adhesive designed for semiconductor die attach and hybrid microelectronic packaging.
EPO-TEK® P1011-2
SIlver Chip Bonding Polyimide
Single component, modified polyimide, silver-filled adhesive designed for chip bonding in microelectronics and optoelectronic applications.
EPO-TEK® P1011-T2
Die Attach Polyimide
Electrically conductive, modified polyimide adhesive designed for die-attach of semiconductors and hybrid IC packaging.
