EPO-TEK® OG116-31
UV Epoxy Encapsulant
Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.
EPO-TEK® OG142-87
Fiber Optic Epoxy Adhesive
Single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging application.
EPO-TEK® OG198-54
UV Curable Epoxy
Single component, low viscosity, electrically and thermally insulating shadow curable UV epoxy.
EPO-TEK® OG198-55
Biocompatible UV Curing Epoxy
Shadow Curable UV Epoxy. Thixotropic version of EPO-TEK® OG198-54.
EPO-TEK® OG198-55-1
UV & UV Hybrid
High viscosity, single component, electrically and thermally insulating UV cure epoxy. It is a thixotropic version of EPO-TEK® OG198-54.
EPO-TEK® OG198-55HV
UV & UV Hybrid
High viscosity, single component, electrically and thermally insulating UV cure epoxy. It is a higher viscosity version of EPO-TEK® OG198-55.
EPO-TEK® OG198-763
UV & UV Hybrid
Medium viscosity, single component, electrically and thermally insulating, translucent UV cure epoxy. It is an intermediate rheology between EPO-TEK® OG198-54 and EPO-TEK® OG198-55.
EPO-TEK® OJ2933-LH
Nonconductive Adhesive
Low halogen snap curable thixotropic longer pot life version of EPO-TEK® 353ND.
