EPO-TEK® TE109-15
Thermally Conductive Epoxy
Longer pot-life version of EPO-TEK® T7109, thermally conductive, electrically insulating epoxy for heat sinking applications.
EPO-TEK® TH106-5
Single Component Thermally Conductive Epoxy
Single component, thermally conductive, electrically insulating epoxy containing 2 mil glass beads for bond-line control in adhesive and sealing applications.
EPO-TEK® TH106-6
Thermally Conductive Epoxy
Black, single component, low halogen, electrically insulating die attach adhesive with extended pot life.
EPO-TEK® TJ1104-LH
Low Halogen Thermally Conductive Epoxy
Black, single component, low halogen, electrically insulating die attach adhesive with extended pot life.
EPO-TEK® TJ2193-LH2
Nonconductive Adhesive
A two component, low-halogen, electrically insulating die attach adhesive with extended pot life.
EPO-TEK® TR2139-LH
Low Halogen Thermally Conductive Epoxy
Two component, electrically insulating epoxy adhesive designed to meet low halogen standards.
EPO-TEK® TZ101
Thermally Conductive Adhesive
Single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics.
EPO-TEK® U300-22
Optically Clear Epoxy
This epoxy offers a long pot-life, high Tg, and optical clarity are a few of its traits. NASA approved low outgassing epoxy suitable for electronic applications such as smart cards, RFIDs, and wafer level camera optics.
