EPO-TEK® OG653
Acrylate-Based UV Cure
UV curable adhesive designed for glob top encapsulation.
EPO-TEK® OG675
Acrylate-Based UV Cure
A UV fast-curing, flexible adhesive with medium viscosity and optical clarity.
EPO-TEK® OH105-2
Nonconductive Adhesive
Two component optically opaque epoxy. It is a more flexible, thixotropic alternative to EPO-TEK® 320.
EPO-TEK® OJ2933-LH
Nonconductive Adhesive
Low halogen snap curable thixotropic longer pot life version of EPO-TEK® 353ND.
EPO-TEK® OM118
Nonconductive Epoxy Adhesive
Two component, optically clear, electrically and thermally insulating epoxy designed for adhesive, sealing, and encapsulation applications found in semiconductor, medical, filtration, and scientific/OEM industries. It is a slightly higher viscosity and Tg alternative to EPO-TEK® 301.
EPO-TEK® OM125
Optical Epoxy Adhesive
Two component, high Tg optical epoxy designed for bonding multi-mode fiber optic connectors.
EPO-TEK® P10
Silver Die Attach Polyimide
A single component, modified polyimide, high-temperature grade, silver-filled, electrically and thermally conductive adhesive designed for semiconductor die attach and hybrid microelectronic packaging.
EPO-TEK® P1011-2
SIlver Chip Bonding Polyimide
Single component, modified polyimide, silver-filled adhesive designed for chip bonding in microelectronics and optoelectronic applications.
