EPO-TEK® T6067
Thermally Conductive Epoxy
A single component, thermally conductive and electrically insulating epoxy designed for semiconductor die attach and bonding of SMDs for hybrid microelectronic packaging. It can be used for heat sinking, solder dam or dielectric layers in circuit assembly applications.
EPO-TEK® T6067-3
Thermally Conductive Epoxy
Single component thermally conductive epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging. It is a lower viscosity version of EPO-TEK® T6067.
EPO-TEK® T7109
Thermal Heatsink Adhesive
Thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid microelectronics, and optical industries.
EPO-TEK® T7109-17
Flexible Thermally Conductive Epoxy
This is a flexible, thermally conductive, electrically insulating epoxy paste designed for low stress and heat dissipation applications within the semiconductor, hybrid, electronic and optical industries.
EPO-TEK® T7109-18
Flexible Electrically Insulating Epoxy Paste
A flexible, electrically insulating epoxy paste designed for low stress and heat dissipation applications.
EPO-TEK® T7109-19
Flexible Thermally Conductive Epoxy
A two component, flexible, thermally conductive, electrically insulating epoxy paste designed for low stress and heat dissipation applications. It is a lower outgassing version of EPO-TEK® T7109-17 with similar thermal management.
EPO-TEK® T7109-20
Flexible Thermally Conductive Epoxy
Flexible thermally conductive epoxy. A more flexible version of EPO-TEK® T7109-19.
EPO-TEK® T7110
Thermally Conductive Electrically Insulating Epoxy
Thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such as consumer or optics.
EPO-TEK® T7110-38
Thermally Conductive, Room-Temperature Cure Epoxy
This is a two component, thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It is designed to be a higher viscosity and more thixotropic version of EPO-TEK® T7110.
