EPO-TEK® P1011S-2
Silver Die Attach Polyimide
Single component, modified polyimide, high temperature grade, silver-filled electrically conductive and thermally conductive adhesive designed for semiconductor die-attached and hybrid microelectronic packaging.
EPO-TEK® P1011ST-2
Silver Die Attach Polyimide
Single component, modified polyimide, high temperature grade, silver-filled electrically conductive and thermally conductive adhesive designed for semiconductor die-attached and hybrid microelectronic packaging. It is a lower viscosity version of P1011-T2.
EPO-TEK® T-7
Thermally Conductive Epoxy
Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in semiconductor, microelectronic, optoelectronics, and general electronic assembly applications. It can be used at the chip or PCB packaging level interconnect.
EPO-TEK® T606-3
Thermally Conductive Epoxy
Single component thermally conductive epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging. It is a lower viscosity version of EPO-TEK® T6067.
EPO-TEK® T6065
Thermally Conductive Epoxy
A single component, high Tg, thermally conductive, semiconductor die-attach grade epoxy. It was designed for bonding chips and SMD's inside hybrid micro-electronic packages. Other applications include JEDEC and opto-electronic packaging.
EPO-TEK® T6067
Thermally Conductive Epoxy
A single component, thermally conductive and electrically insulating epoxy designed for semiconductor die attach and bonding of SMDs for hybrid microelectronic packaging. It can be used for heat sinking, solder dam or dielectric layers in circuit assembly applications.
EPO-TEK® T7109
Thermal Heatsink Adhesive
Thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid microelectronics, and optical industries.
EPO-TEK® T7109-17
Flexible Thermally Conductive Epoxy
This is a flexible, thermally conductive, electrically insulating epoxy paste designed for low stress and heat dissipation applications within the semiconductor, hybrid, electronic and optical industries.
EPO-TEK® T7109-18
Flexible Electrically Insulating Epoxy Paste
A flexible, electrically insulating epoxy paste designed for low stress and heat dissipation applications.
