Network6

Product finder

246 matches
Viewing options:
Viewing options:
ASI 502

ASI 502

High Performance 100% RTV Silicone

ASI 502 100% RTV Silicone is a one-component, moisture cure, acetoxy silicone that cures to form an extremely durable rubber that can withstand a variety of extreme environments.Unlike many organic sealants, ASI 502 is extremely resistant to degradation,...

View product
ASI 505

ASI 505

Industrial Grade Self-Leveling Silicone

ASI 505 Self-Leveling RTV Silicone is a one-component, moisture cure, flowable material designed for a variety of potting, coating, sealing and waterproofing applications.Once applied, ASI 505 will begin skinning in 8 minutes and continue curing to form a...

View product
ASI 600

ASI 600

Hi-Temp Resistant RTV Silicone

ASI 600 Hi-Temp Resistant RTV Silicone is a one-component, moisture cure, 100% RTV silicone that cures to form an extremely durable rubber that can withstand extreme heat while maintaining its physical properties.Due to the formulation, ASI 600 can...

View product
EPO-TEK® 930-4

EPO-TEK® 930-4

Thermally Conductive Adhesive

Two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Also available in a single component frozen syringe. 

View product
EPO-TEK® EK1000

EPO-TEK® EK1000

Electrically & Thermally Conductive Epoxy

High thermal conductive silver filled adhesive.

TDS
View product
EPO-TEK® H20E

EPO-TEK® H20E

Electrically & Thermally Conductive Epoxy

100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.

TDS
View product
EPO-TEK® H20E-HC

EPO-TEK® H20E-HC

Electrically & Thermally Conductive Epoxy

High thermal conductivity version of EPO-TEK® H20E.

TDS
View product
EPO-TEK® H20E-MP

EPO-TEK® H20E-MP

Electrically & Thermally Conductive Epoxy

Low outgassing silver epoxy meeting MIL-STD 883 /5011 and NASA ASTM E595.

TDS
View product
EPO-TEK® H20S

EPO-TEK® H20S

Electrically & Thermally Conductive Epoxy

100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic 

TDS
View product
  • 1
  • 2