EPO-TEK® EK1000-1-D
Silver Conductive Epoxy
A longer dry time and low viscosity version of EPO-TEK® EK1000 designed for applications requiring longer working time and better flowing than provided by EPO-TEK® EK1000. Offers exceptional thermal management.
EPO-TEK® EK1000-1MP
Electrically Conductive, Silver Epoxy
This single component product offers exceptionally high thermal conductivity making it perfect for power and thermal management. It is a longer dry-time version of EPO-TEK® EK1000-MP and is designed for applications requiring long work times including hybrid die...
EPO-TEK® EK1000-MP
Silver Conductive Epoxy
A single-component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity, along with a shiny silver appearance, making it ideal for the demanding requirements of high-power LED die attach applications.
EPO-TEK® EK2000
Exceptional Electrical Conductivity
This silver-filled adheseivs exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding requirements of high power LED die attach applications. Other benefits include low viscosity and high thixotropy making...
EPO-TEK® EM127
Electrically Conductive Adhesive
Single component, heat curable, electrically conductive epoxy adhesive for semiconductor IC and LED die attach applications.
EPO-TEK® EV2118-2
Silver Conductive Epoxy
A silver-filled, electrically conductive epoxy designed for semiconductor and electronic assembly.
EPO-TEK® GD2191
Thermally Conductive Epoxy
Two component, thermally conductive, electrically insulating epoxy with long pot life and adhesion to stainless steel.
EPO-TEK® GE120
Nonconductive Adhesive
Single component, thixotropic, electrically and thermally insulating epoxy adhesive designed for bonding SMDs to PCBs. It can be used for electronic assembly in many devices including consumer electronics, cell phone, telecommunications, automotive, and scientific/OEM.
EPO-TEK® H20E-175
Electrically Conductive Adhesive
Two component epoxy designed for semiconductor die-attach. It is a higher Tg version of EPO-TEK® H20E. It was designed to be used in semiconductor/JEDEC packaging, microelectronic packaging of hybrids, as well as high temperature devices and assembly.
