EPO-TEK® E2101
Electrically Conductive, Silver Epoxy
A two component, thixotropic, electrically conductive adhesive.
EPO-TEK® E3001-6
Electrically Conductive, Silver-Filled Epoxy
This is a single component, electrically and thermally conductive,snap cure, die attach epoxy. It was designed for JEDEC level IC plastic packaging of semiconductors, hybrid micro-electronics and photonic device assembly. It is a single component version of EPO-TEK®...
EPO-TEK® E4110
Electrically Conductive Adhesive
EPO-TEK® E4110 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although other heat cures can be used.
EPO-TEK® E4110-LV
Electrically Conductive Adhesive
EPO-TEK® E4110LV is an electrically conductive, silver-filled flowing epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although other heat cures can be used.
EPO-TEK® E4110-PFC
Electrically Conductive Adhesive
Two component, silver filled, electrically conductive adhesive designed for semiconductor IC packaging and general electronic assembly. It is a thixotropic version of EPO-TEK® E4110, suggested for applications requiring a screen printing process as well as jetting.
EPO-TEK® EE178-9
Electrically Conductive Adhesive
A two component, electrically conductive epoxy adhesive designed for semiconductor, hybrid, PCB and optoelectronic assemblies. It was designed for precision dispensing or stamping of small dot arrays, in ultra fine pitch applications such as connectors to flex-PCB, SMD...
EPO-TEK® EJ2108
Flexible, Silver-filled Adhesive
This is a two component flexible, silver-filled, electrically and thermally conductive low temperature curing adhesive.
EPO-TEK® EJ2189
Electrically Conductive Epoxy
This is an silver-filled epoxy paste designed for low temperature curing from ambient to 80°C, although other heat cures can be used.
EPO-TEK® EJ2189-LV
Electrically Conductive Epoxy
This is an electrically conductive silver-filled epoxy paste designed for low temperature curing from ambient to 80°C.
