EPO-TEK® H21D
High Tg Silver Epoxy
High glass transition temperature silver epoxy designed for chip bonding in microelectronic and optoelectronic applications.
EPO-TEK® H22
Electrical Conductive, Silver Epoxy
This silver-filled system is engineered specifically for die bonding and sealing hybrid circuit packages.
EPO-TEK® H24
Electrically Conductive Adhesive
EPO-TEK® H24 is a two component, electrically and thermally conductive epoxy adhesive designed for semiconductor die attach and hybrid micro-electronics assembly.
EPO-TEK® H27D
Electrically Conductive Adhesive
Two component, silver-filled adhesive designed for semiconductor and hybrid microelectronic packaging applications.
EPO-TEK® H31
Electrically Conductive Adhesive
EPO-TEK® H31 is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electronic packaging.
EPO-TEK® H31D
Electrically Conductive Adhesive
EPO-TEK® H31D is a single component, electrically conductive silver epoxy designed for die-bonding of semiconductors, including IC’s, resistors, capacitors, transistors, and diodes which may be found in opto-electronics packaging or hybrid micro-electronics.
EPO-TEK® H35-175MP
Low Outgassing Silver Epoxy
Low outgassing silver Epoxy meeting MIL-STD 883 /5011 and NASA ASTM E585.
EPO-TEK® H35-175MPLV
Silver Conductive Epoxy
A single-component, silver-filled epoxy engineered for hybrid die and component attachment, featuring a lower viscosity formulation compared to EPO-TEK® H35-175MP.
EPO-TEK® H35-175MPT
Silver Conductive Epoxy
A single component, silver-filled epoxy for hybrid die and component attach. This product is a higher thixotropic version of EPO-TEK® H35-175MP.
