EPO-TEK® H20S
Silver Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronics.
EPO-TEK® H35-175MP
Low Outgassing Silver Epoxy
Low outgassing silver Epoxy meeting MIL-STD 883 /5011 and NASA ASTM E585.
EPO-TEK® H37-MP
Low Temperature Cure Epoxy
Low stress and low temperature cure temperature version of H35-175MP.
EPO-TEK® H70E
Electrically Insulating Epoxy
Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.
EPO-TEK® H70E-175
Thermally Conductive Epoxy
EPO-TEK® H70E-175 is a two component, thermally conductive, electrically insulating epoxy adhesive for semiconductor, microelectronic and opto-electronic packaging. It may be used in aluminum heat sinking power devices in the form of hybrid circuits or at the SMD/PCB...
EPO-TEK® H70S
Thermally Conductive Epoxy
Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping
EPO-TEK® H74-110
Nonconductive Epoxy Adhesive
Two component, electrically and thermally insulating epoxy adhesive designed for semiconductor, electronics, and optical applications. It is an IR transparent version of EPO-TEK® H74 which enables fiber optic and photonic-packaging.
EPO-TEK® HYB-297-RT
UV & UV Hybrid
Single component epoxy for fiber optic and semiconductor applications. It is designed to have similar cured performance to EPO-TEK® 301-2, but has been modified to allow for initial UV tacking to simplify the production process.
EPO-TEK® HYB-297-RT-HV
UV & UV Hybrid
Single component epoxy for fiber optic and semiconductor applications. It is a higher viscosity version of EPO-TEK® HYB-297-RT. It is designed to have similar cured performance to EPO-TEK® 301-2, btu has been modified to allow for initial UV...
