EPO-TEK® H70S
Thermally Conductive Epoxy
Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping
EPO-TEK® H72
Thermally Conductive Epoxy
EPO-TEK® H72 is a two component, high Tg, thermally conductive and electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies.
EPO-TEK® H74
Thermally Conductive Epoxy
This thermally conductive epoxy is designed for hybrid circuit assembly including die attach, substrate attach, lid-seal, heat dissipation, and hermetic sealing in general.
EPO-TEK® H74-110
Nonconductive Epoxy Adhesive
Two component, electrically and thermally insulating epoxy adhesive designed for semiconductor, electronics, and optical applications. It is an IR transparent version of EPO-TEK® H74 which enables fiber optic and photonic-packaging.
EPO-TEK® H74F
Thermally Conductive Epoxy
A two component, high Tg, thermally conductive, electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies. It may be used for flip chip underfill, sealing sensor devices packaged in TO-cans or fiber...
EPO-TEK® H77
Thermally Conductive, Electrically Insulating Epoxy
Designed for lid sealing of hybrids found in hermetic packaging of micro-electronics. Lids can be ceramic, glass, aluminum or kovar. Package types can be plastic, metal cases, or ceramic.
EPO-TEK® H77 Black
Thermally Conductive Epoxy
EPO-TEK® H77 Black is a two component, thermally conductive, electrically insulating epoxy system designed for lid-sealing of hybrids found in hermetic packaging of micro-electronics. Lids can be ceramic, glass, aluminum or kovar. Package types can be plastic, metal...
EPO-TEK® H77S
Thermally Conductive, Electrically Insulating Epoxy
This two component epoxy is a thermally conductive, electrically insulating epoxy is design for high temperature applications. It is a smaller particle version of EPO-TEK® H77.
EPO-TEK® H81
Electrically Conductive Adhesive
A two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.
