EPO-TEK® T905BN-3
Thermally Conductive Epoxy
A thermally conductive, electrically insulating epoxy designed for heat sinking and encapsulation.
EPO-TEK® TD1001
Thermally Conductive Epoxy
This is single component, thermally conductive, electrically insulating epoxy designed for lowstress semiconductor and electronics packaging.
EPO-TEK® TD1001-67
Thermally Conductive Epoxy
A soft single component, thermally conductive, electrically insulating epoxy. It is a more flexible version of EPO-TEK® TD1001. Optimal for stress relief applications with its low Tg and long pot life. Suitable for bonding ferrite cores in power...
EPO-TEK® TJ2139-LH Black
Thermally Conductive Epoxy
This two component epoxy is low-halogen, electrically insulating die attach adhesive with long pot life.
EPO-TEK® TV2001
Thermally Conductive Epoxy
A two component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging. Low Tg, moderate pot-life, snap-curing and very low modulus are a few of its traits.

EPO-TEK® TZ101
Thermally Conductive Adhesive
Single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics.
EPO-TEK® U300-22
Optically Clear Epoxy
This epoxy offers a long pot-life, high Tg, and optical clarity are a few of its traits. NASA approved low outgassing epoxy suitable for electronic applications such as smart cards, RFIDs, and wafer level camera optics.
EPO-TEK® UD1355
Epoxy-Based Thermal Post Cure
Optically clear, low-viscosity UV adhesive and encapsulant with resistance to discoloration during solder reflow.
EPO-TEK® UJ1190
Epoxy-Based Thermal Post Cure
Low-viscosity, clear UV epoxy ideal for thick sections.