Network6

Product finder

495 matches
Viewing options:
495 matches
Viewing options:

EPO-TEK® H65-175MP

Thermally Conductive Epoxy

EPO-TEK® H65-175MP is a single component, alumina-filled epoxy for hybrid die and component attach.  It can also be used for semiconductor and high temperature ceramic and vauum packaging.

View product
EPO-TEK® H67-MP

EPO-TEK® H67-MP

Thermally Conductive Epoxy

Single component, thermally conductive epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging.

View product
EPO-TEK® H70E

EPO-TEK® H70E

Electrically Insulating Epoxy

Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.

View product

EPO-TEK® H70E-1

Thermally Conductive Epoxy

Two component, thermally conductive, electrically insulating epoxy adhesive for semiconductor and  microelectronic packaging. It is most commonly used for die-attach and heat sinking applications.

View product

EPO-TEK® H70E-175

Thermally Conductive Epoxy

EPO-TEK® H70E-175 is a two component, thermally conductive, electrically insulating epoxy adhesive for semiconductor, microelectronic and opto-electronic packaging. It may be used in aluminum heat sinking power devices in the form of hybrid circuits or at the SMD/PCB...

View product

EPO-TEK® H70E-2

Thermally Conductive, Electrically Insulating Epoxy

A two component, thermally conductive epoxy.  Ease of use: long pot-life with low temperature cure of 80°C possible. 

View product
EPO-TEK® H70S

EPO-TEK® H70S

Thermally Conductive Epoxy

Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping 

View product

EPO-TEK® H72

Thermally Conductive Epoxy

EPO-TEK® H72 is a two component, high Tg, thermally conductive and electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies.

View product

EPO-TEK® H74

Thermally Conductive Epoxy

This thermally conductive epoxy is designed for hybrid circuit assembly including die attach, substrate attach, lid-seal, heat dissipation, and hermetic sealing in general.

View product