20-3003
Potting & Encapsulating
20-3003 is a low viscosity, potting, encapsulating, and adhesive system. Its low viscosity allows for good flow and wetting of substrates.
20-3004
Potting & Encapsulating
20-3004LV & HV are two component chemical resistant epoxy systems. They are developed for potting, coating, and adhesive applications requiring superior chemical resistance and exhibit outstanding bonds to a variety of substrates.
20-3006
Potting & Encapsulating
20-3006 is a unique two component, electronic grade, flexible epoxy potting compound. This system was engineered to provide electrical insulation, chemical protection, and thermal shock resistance.
20-3030
Potting & Encapsulating
20-3030 is an unfilled, low viscosity epoxy system. This system was designed for fast, self-leveling and ease of use. 20-3030 has a convenient 2:1 mix ratio and will cure at room temperature
20-3035
Potting & Encapsulating
20-3035 is a low density, two component epoxy potting and encapsulating system. The 20-3035 is less than half the weight of most commercially available potting compounds