EPO-TEK® EK1000-MP
Silver Conductive Epoxy
A single-component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity, along with a shiny silver appearance, making it ideal for the demanding requirements of high-power LED die attach applications.
EPO-TEK® EK2000
Exceptional Electrical Conductivity
This silver-filled adheseivs exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding requirements of high power LED die attach applications. Other benefits include low viscosity and high thixotropy making...
EPO-TEK® EM127
Electrically Conductive Adhesive
Single component, heat curable, electrically conductive epoxy adhesive for semiconductor IC and LED die attach applications.
EPO-TEK® EV2118-2
Silver Conductive Epoxy
A silver-filled, electrically conductive epoxy designed for semiconductor and electronic assembly.
EPO-TEK® GD2191
Thermally Conductive Epoxy
Two component, thermally conductive, electrically insulating epoxy with long pot life and adhesion to stainless steel.
EPO-TEK® GE120
Nonconductive Adhesive
Single component, thixotropic, electrically and thermally insulating epoxy adhesive designed for bonding SMDs to PCBs. It can be used for electronic assembly in many devices including consumer electronics, cell phone, telecommunications, automotive, and scientific/OEM.
EPO-TEK® H20E-175
Electrically Conductive Adhesive
Two component epoxy designed for semiconductor die-attach. It is a higher Tg version of EPO-TEK® H20E. It was designed to be used in semiconductor/JEDEC packaging, microelectronic packaging of hybrids, as well as high temperature devices and assembly.
EPO-TEK® H20E-8
Electrically Conductive Adhesive
Two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a higher viscosity and higher thixotropic version of EPO-TEK® H20E.
EPO-TEK® H20E-D
Electrically Conductive Adhesive
Single component, 100% solids, silver-filed epoxy designed for electrically and thermally conductive bonds. It is an enhanced version of EPO-TEK® H20E.
