20-3037
Potting & Encapsulating
20-3037 is a low density, two component epoxy bonding and sealing system. The 20-3037 is less than half the weight of most commercially available potting compounds.
20-3063
Potting & Encapsulating
20-3063 is an electronic grade potting and encapsulating compound. This epoxy system is designed for applications requiring an easy and affordable potting process.
20-3064
Potting & Encapsulating
20-3064 NC is a filled Epoxy Resin System engineered to give the end user the ability to control the hardness of the cured casting. By varying the mix ratio, the hardness can be varied from 60 Shore A...
20-3068
Potting & Encapsulating
20-3068 is a room temperature curing, two component, epoxy potting compound and adhesive. This product provides good water resistance, adhesion, and toughness.