EPO-TEK® OD1001-67
Optical Epoxy
A single component, electrically insulating epoxy designed as a low stress underfill adhesive for large die. This is a more flowable modification of TD1001-67.
EPO-TEK® OD1001-67 White
Optical Epoxy
A white pigmented version of EPO-TEK® OD1001-67. It is a single component, electrically insulating epoxy designed as a low stress underfill adhesive for large die. It is also a more flowable version of EPO-TEK® TD1001-67.
EPO-TEK® OD2002
High Tg Optical Epoxy
This is a two-component, thermally and electrically insulating optical epoxy. It is designed as a high glass transition temperature (Tg), yet still compliant, alternative to EPO-TEK® 353ND.
EPO-TEK® OE121
Underfill Epoxy Adhesive
Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...
EPO-TEK® OE121 Black
Underfill Epoxy Adhesive
Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...
EPO-TEK® OG116
Epoxy-Based Thermal Post Cure
A single-component, high-index, high glass transition temperature (Tg), UV-curable adhesive with high viscosity. Offers good chemical resistance.
EPO-TEK® OG116-31
UV Epoxy Encapsulant
Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.
EPO-TEK® OG133-7
Flexible UV Cure
This is a single component, UV curable flexible epoxy adhesive/encapsulant designed for semiconductor and opto-electronic packaging.
EPO-TEK® OG133-8
UV Curable Epoxy
A single-component, thixotropic flexible epoxy/encapsulant designed for semiconductor and opto-electronic packaging. Glob top over IC and wire bonds, as well as low-stress bonding of fiber optic components, are typical applications.