Laser optics

Overview

Our UV and UV Hybrid Epoxy line delivers fast, photocurable adhesives ideal for applications in electronics, medical devices, and photonics. These single-component systems simplify processing with quick UV curing and an unlimited pot life, offering efficient bonding for fiber optics, lenses, and PCBs. UV hybrids add versatility with their two-step process—UV tack for immediate positioning, followed by thermal curing for high-reliability bonds. EPO-TEK®’s UV adhesives support rapid throughput while maintaining robust adhesion, ideal for industries requiring precise alignment and high-performance materials such as active alignment in LiDAR.

Products

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EPO-TEK® HYB-353ND

EPO-TEK® HYB-353ND

UV Hybrid

A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. 

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EPO-TEK® HYB-353ND-HV

EPO-TEK® HYB-353ND-HV

UV Hybrid Curing Epoxy

A single component, high temperature epoxy for semiconductor, hybrid, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a higher viscosity version of...

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EPO-TEK® HYB-353ND-LV

EPO-TEK® HYB-353ND-LV

Low Viscosity UV Hybrid Epoxy

A single component, high temperature hybrid epoxy for semiconductor and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a lower viscosity version of...

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EPO-TEK® HYB-353ND-TX2

EPO-TEK® HYB-353ND-TX2

UV Hybrid Epoxy

A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications. 

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EPO-TEK® OG116-31

EPO-TEK® OG116-31

UV Epoxy Encapsulant

Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.

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EPO-TEK® OG198-54

EPO-TEK® OG198-54

UV Curable Epoxy

Single component, low viscosity, electrically and thermally insulating shadow curable UV epoxy. 

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EPO-TEK® OG198-55

EPO-TEK® OG198-55

Biocompatible UV Curing Epoxy

Shadow Curable UV Epoxy. Thixotropic version of EPO-TEK® OG198-54.

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EPO-TEK® OG142-112LH

EPO-TEK® OG142-112LH

UV Curable Epoxy Adhesive

Low halogen version of OG142-112, single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging applications.

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EPO-TEK® OG142-87

EPO-TEK® OG142-87

Fiber Optic Epoxy Adhesive

Single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging application. 

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EPO-TEK® OG142-95

UV Curable Epoxy

A single component, low viscosity, UV curable epoxy. It is a replacement version of EPOTEK® OG142-17 with better bonding strength and moisture resistance; thermal post-cure beneficial.

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EPO-TEK® OG116

Epoxy-Based Thermal Post Cure

A single-component, high-index, high glass transition temperature (Tg), UV-curable adhesive with high viscosity. Offers good chemical resistance.

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EPO-TEK® OG142-112

UV Cure Optical Epoxy

This single component, low viscosity epoxy is designed for adhesive sealing and encasulating fiber optic and opto-clectronic packaging applications.

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EPO-TEK® OG159-2

Epoxy-Based Thermal Post-Cure

EPO-TEK® OG159-2 is a single component, high-viscosity, UV-curable epoxy for bonding glass plates in display applications. It’s thixotropic, moisture-resistant, and includes 1 mil glass beads for bond line control.

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EPO-TEK® UD1355

Epoxy-Based Thermal Post Cure

Optically clear, low-viscosity UV adhesive and encapsulant with resistance to discoloration during solder reflow.

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EPO-TEK® OG133-7

Flexible UV Cure

This is a single component, UV curable flexible epoxy adhesive/encapsulant designed for semiconductor and opto-electronic packaging.  

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EPO-TEK® OG133-8

UV Curable Epoxy

A single-component, thixotropic flexible epoxy/encapsulant designed for semiconductor and opto-electronic packaging.  Glob top over IC and wire bonds, as well as low-stress bonding of fiber optic components, are typical applications. 

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EPO-TEK® OG154-1

UV Optical Cure

A single compound UV curable epoxy adhesive for the semiconductor, opto-electronics, medical, and scientific OEM industry.

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EPO-TEK® OG603

Acrylate-Based UV Cure

This all-purpose general adhesive is a single-component, low viscosity, UV-curable formula that cures in seconds for optical applications, medical uses, and PCB-level electro-optics. It is also suitable for sealing and coating applications.

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EPO-TEK® OG653

Acrylate-Based UV Cure

UV curable adhesive designed for glob top encapsulation.

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EPO-TEK® OG675

Acrylate-Based UV Cure

A UV fast-curing, flexible adhesive with medium viscosity and optical clarity. 

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