Medical device

Overview

EPO-TEK® offers a diverse range of electrically conductive epoxies designed for demanding applications in industries such as microelectronics, photonics, aerospace and defense, and medical devices. Known for their strong adhesion and high electrical and thermal conductivity, EPO-TEK®’s solutions are ideal for die-attach, microwave and RF, hermetic enclosure, and thermal management. Products like H20E are widely used for chip bonding and thermal management in microelectronics. EPO-TEK®’s electrically conductive adhesives are also known for being high reliability (HI-REL) die attachment adhesives and are commonly used in military applications (MIL-STD).

Products

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EPO-TEK® 377H

EPO-TEK® 377H

Graphite Filled Bonding Epoxy

Graphite-filled, High Temperature Epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer, military, and optical/OEM /fiber optics. It is an electrically conductive version of EPO-TEK® 377.

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EPO-TEK® H20E

EPO-TEK® H20E

Silver Filled Electrically Conductive Epoxy

100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.

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EPO-TEK® H20E-HC

EPO-TEK® H20E-HC

High Thermal Conductivity Epoxy

High thermal conductivity version of EPO-TEK® H20E.

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EPO-TEK® H20E-MP

EPO-TEK® H20E-MP

Electrically Conductive Silver Epoxy

Low outgassing silver epoxy meeting MIL-STD 883 /5011 and NASA ASTM E595.

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EPO-TEK® H20S

EPO-TEK® H20S

Silver Conductive Epoxy

100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronics.

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EPO-TEK® H21D

EPO-TEK® H21D

High Tg Silver Epoxy

High glass transition temperature silver epoxy designed for chip bonding in microelectronic and optoelectronic applications. 

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EPO-TEK® H35-175MP

EPO-TEK® H35-175MP

Low Outgassing Silver Epoxy

Low outgassing silver Epoxy meeting MIL-STD 883 /5011 and NASA ASTM E585.

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EPO-TEK® H37-MP

EPO-TEK® H37-MP

Low Temperature Cure Epoxy

Low stress and low temperature cure temperature version of H35-175MP.

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EPO-TEK® EJ2189-LV

Electrically Conductive Epoxy

This is an electrically conductive silver-filled epoxy paste designed for low temperature curing from ambient to 80°C.

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EPO-TEK® EJ2312

Room Temperature Curing ECA

Two component room temperature curing electrically conductive adhesive.

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EPO-TEK® EJ2108

Flexible, Silver-filled Adhesive

This is a two component flexible, silver-filled, electrically and thermally conductive low temperature curing adhesive.

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EPO-TEK® H20E-PFC

Electrically Conductive, Silver Epoxy

Temiconductor grade epoxy, designed for flip chip interconnects using a solder-free joining method.

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EPO-TEK® H20E-PFC-D

Silver Conductive Epoxy

A single component, semiconductor-grade epoxy designed for improved dispensing.

SDS
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EPO-TEK® H22

Electrical Conductive, Silver Epoxy

This silver-filled system is engineered specifically for die bonding and sealing hybrid circuit packages.

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EPO-TEK® EK1000

EPO-TEK® EK1000

Electrically Conductive Silver Filled Adhesive

High thermal conductive silver filled adhesive.

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EPO-TEK® EK1000-1

Silver Conductive Epoxy

This is a single component, longer dry time version of EPO-TEK® EK1000 designed for applications requiring longer working time.  Offers exeptional thermal management.

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EPO-TEK® EK1000-1-D

Silver Conductive Epoxy

A longer dry time and low viscosity version of EPO-TEK® EK1000 designed for applications requiring longer working time and better flowing than provided by EPO-TEK® EK1000.  Offers exceptional thermal management.

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EPO-TEK® EK1000-MP

Silver Conductive Epoxy

A single-component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity, along with a shiny silver appearance, making it ideal for the demanding requirements of high-power LED die attach applications.

TDS
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EPO-TEK® EK2000

Exceptional Electrical Conductivity

This silver-filled adheseivs exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding requirements of high power LED die attach applications.  Other benefits include low viscosity and high thixotropy making...

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EPO-TEK® EV2118-2

Silver Conductive Epoxy

A silver-filled, electrically conductive epoxy designed for semiconductor and electronic assembly.

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EPO-TEK® E2101

Electrically Conductive, Silver Epoxy

A two component, thixotropic, electrically conductive adhesive.

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EPO-TEK® H35-175MPLV

Silver Conductive Epoxy

A single-component, silver-filled epoxy engineered for hybrid die and component attachment, featuring a lower viscosity formulation compared to EPO-TEK® H35-175MP.

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EPO-TEK® H35-175MPT

Silver Conductive Epoxy

A single component, silver-filled epoxy for hybrid die and component attach.  This product is a higher thixotropic version of EPO-TEK® H35-175MP.

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EPO-TEK® H37MP-2

Silver Conductive Epoxy

A single component, silver-filled and electrically conductive adhesive designed for semiconductor die attach and bonding of SMDs for hybrid microelectronic packaging.  

SDS
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EPO-TEK® H37-MPT

Silver Conductive Adhesive

A single component, silver-filled and electrically conductive adhesive designed for smeiconductor die attach and bonding SMDs for hybrid microelectronic packaging.  It can be used for opto-packaging including LEDs, laser and photo-diodes, and fiber optic circuit assembly.

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