Electrically Conductive Epoxies

Graphite-filled, High Temperature Epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer, military, and optical/OEM /fiber optics. It is an electrically conductive version of EPO-TEK® 377.

100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.

High thermal conductivity version of EPO-TEK® H20E.

Low outgassing silver epoxy meeting MIL-STD 883 /5011 and NASA ASTM E595.

100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronics.

High glass transition temperature silver epoxy designed for chip bonding in microelectronic and optoelectronic applications. 

Low outgassing silver Epoxy meeting MIL-STD 883 /5011 and NASA ASTM E585.

Low stress and low temperature cure temperature version of H35-175MP.

This is an electrically conductive silver-filled epoxy paste designed for low temperature curing from ambient to 80°C.

Two component room temperature curing electrically conductive adhesive.

This is a two component flexible, silver-filled, electrically and thermally conductive low temperature curing adhesive.

Temiconductor grade epoxy, designed for flip chip interconnects using a solder-free joining method.

A single component, semiconductor-grade epoxy designed for improved dispensing.

This silver-filled system is engineered specifically for die bonding and sealing hybrid circuit packages.

High thermal conductive silver filled adhesive.

This is a single component, longer dry time version of EPO-TEK® EK1000 designed for applications requiring longer working time.  Offers exeptional thermal management.

A longer dry time and low viscosity version of EPO-TEK® EK1000 designed for applications requiring longer working time and better flowing than provided by EPO-TEK® EK1000.  Offers exceptional thermal management.

A single-component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity, along with a shiny silver appearance, making it ideal for the demanding requirements of high-power LED die attach applications.

This silver-filled adheseivs exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding requirements of high power LED die attach applications.  Other benefits include low viscosity and high thixotropy making...

A silver-filled, electrically conductive epoxy designed for semiconductor and electronic assembly.

A two component, thixotropic, electrically conductive adhesive.

A single-component, silver-filled epoxy engineered for hybrid die and component attachment, featuring a lower viscosity formulation compared to EPO-TEK® H35-175MP.

A single component, silver-filled epoxy for hybrid die and component attach.  This product is a higher thixotropic version of EPO-TEK® H35-175MP.

A single component, silver-filled and electrically conductive adhesive designed for semiconductor die attach and bonding of SMDs for hybrid microelectronic packaging.  

A single component, silver-filled and electrically conductive adhesive designed for smeiconductor die attach and bonding SMDs for hybrid microelectronic packaging.  It can be used for opto-packaging including LEDs, laser and photo-diodes, and fiber optic circuit assembly.

EPO-TEK® H20E-FC is a two-component, electrically conductive, snap curing epoxy for photovoltaic thin film module stringing, semiconductor packaging and PCB circuit assembly.

This is a two-component, electrically conductive, epoxy adhesive designed for solar ribbon bonding of photovoltaic modules. It provides the electrical back-contact for ribbon stringing of solar cells into modules and panels.  It is a higher viscosity version ofEPO-TEK®...