Thermally Conductive Epoxies

Two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Also available in a single component frozen syringe. 

Single component, thermally conductive epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging.

Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.

Thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid microelectronics, and optical industries.

Single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics. 

Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping 

This two component epoxy is low-halogen, electrically insulating die attach adhesive with long pot life.

A two component, flexible, thermally conductive, electrically insulating epoxy paste designed for low stress and heat dissipation applications. It is a lower outgassing version of EPO-TEK® T7109-17 with similar thermal management.

This is a flexible, thermally conductive, electrically insulating epoxy paste designed for low stress and heat dissipation applications within the semiconductor, hybrid, electronic and optical industries.

A thermally conductive, electrically insulating epoxy designed for heat sinking and encapsulation.

A two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle.  Ease of use: long pot-life with low temperature cure of 80°C possible. 

Designed for lid sealing of hybrids found in hermetic packaging of micro-electronics. Lids can be ceramic, glass, aluminum or kovar. Package types can be plastic, metal cases, or ceramic.

A soft single component, thermally conductive, electrically insulating epoxy. It is a more flexible version of EPO-TEK® TD1001. Optimal for stress relief applications with its low Tg and long pot life. Suitable for bonding ferrite cores in power...

This is single component, thermally conductive, electrically insulating epoxy designed for lowstress semiconductor and electronics packaging.

This thermally conductive epoxy is designed for hybrid circuit assembly including die attach, substrate attach, lid-seal, heat dissipation, and hermetic sealing in general.

This product is designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB and optical industries.  It can be an adhesive for mounting heat sinks and substrates, a seal for many types of packages, or a thermal...

This product is a two component, high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It is a low viscosity version of EPO-TEK® 920.

A single component, thermally conductive, low-halogen, B-Stage epoxy paste.

This single component epoxy is designed for low stress and semiconductor and electronics packaging.  Low Tg, several weeks of pot lif and low modulus are a few of its traits.  

A white pigmented version of EPO-TEK® OD1001-67. It is a single component, electrically insulating epoxy designed as a low stress underfill adhesive for large die. It is also a more flowable version of EPO-TEK® TD1001-67.

A single component, thermally conductive, electrically insulating, epoxy adhesive for semiconductor, hybrid IC, and electronic circuit assembly applications.

A single component, electrically insulating, and thermally conductive epoxy adhesive. It maybe used for heat-sinking semiconductor, hybrids, or electronic circuits.

This is a two component, thermally conductive, electrically insulating epoxy adhesive for semiconductor, micro-electronic and opto-electronic packaging. It may be used for heat sinking power devices in the form of hybrid circuits or at the SMD/PCB level.

A two component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging. Low Tg, moderate pot-life, snap-curing and very low modulus are a few of its traits.