Optical Epoxies

Room temperature curing epoxy featuring very low viscosity, clear and excellence optical-mechanical properties.

Optically transparent and semiconductor grade epoxy resin with low viscosity, long pot life and good handling characteristics. 

Black-colored and optically opaque epoxy designed for optical and optoelectronic packaging of semiconductor devices and components. It is a widely used fiber-optic grade epoxy. 

High Temperature  Resistance & Low outgassing Epoxy Meeting NASA ASTM E595 & Telcordia GR-1221.

Highly thixotropic epoxy with non-flowing properties and high temperature resistance. 

Long pot life, high temperature epoxy designed for semiconductor, hybrid, fiber, and optical applications.  Fiber optic adhesive designed to meet Telecordia 1221.

Low Halogen, Low Temperature Cure and High Tg Optical epoxy. Faster Curing than our GOLD STANDARD EPO-TEK® 353ND

This two-component solution is commonly used for potting, casting, and encapsulation, and is suitable for semiconductor applications like underfill for flip chips and glob top encapsulation. This adhesive is impact and vibration resistant, making it perfect for bonding...

 A two-component epoxy used for optical, fiber optic, and semiconductor applications.  The epoxy is good for adhesive joining, sealing, potting, or as a coating.

This two-component, high temperature epoxy designed for semiconductors, hybrid, and fiber optic applications.  Also available in a single component frozen syringe.

A two component, semi-rigid, optical grade epoxy for semiconductor packaging of fiber optics and optoelectronics devices.  It is an electrically and thermally insulating epoxy. 

A two component, optically clear, flexible epoxy adhesive designed for optical applications within semiconductorand fiber optic industries. An alternative to EPO-TEK® 310M.

A two component, black colored and optically opaque epoxy designed for optical, medical, and opto-electronic packaging of semiconductor devices and components. It is a modification of EPO-TEK® 320 for increased electrical insulation. It is also more viscous and...

This two component, high Tg epoxy is designed for semiconductor packaging in medical, fiber optic and optoelectronic assemblies. It is an electrically and thermally insulating epoxy.

EPO-TEK® 354-T2 is a two component, thixotropic, high Tg epoxy designed for semiconductor packaging in medical, fiber optic and optoelectronic assemblies. It is an electrically and thermally insulating epoxy and a more thixotropic version of EPO-TEK® 354-2.

This two-component, high-temperature grade epoxy is designed for semiconductor, electronics, and fiber optics applications; its unfilled resin enables high transmission in the VIS and NIR ranges, while its low viscosity supports wicking and capillary action.

EPO-TEK® 377 is a two-component, high Tg epoxy ideal for fiber optics, semiconductor, and optical applications. Its low viscosity ensures excellent handling and versatility in application methods, including encapsulating and potting. NASA-approved for low outgassing,

EPO-TEK® 383ND is a two component, high temperature, electrically and thermally insulating epoxy. Designedas a longer pot life version of EPO-TEK® 353ND.

This is a two-component, thermally and electrically insulating optical epoxy. It is designed as a high glass transition temperature (Tg), yet still compliant, alternative to EPO-TEK® 353ND.

This is a single component, high temperature hybrid epoxy for semiconductor and fiber optic applications. It is engineered to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a higher thixotropy...

This epoxy offers a long pot-life, high Tg, and optical clarity are a few of its traits. NASA approved low outgassing epoxy suitable for electronic applications such as smart cards, RFIDs, and wafer level camera optics.

This a two component optical epoxy low index version of EPO-TEK® 301-2FL. It features very low viscosity and excellent optical-mechanical properties.

EPO-TEK® 301-2FL-G is a two component optical and semiconductor grade epoxy resin. It is a version of EPO-TEK® 301-2FL with an indicator added for enhanced process control.

A two-component, optical and semiconductor grade epoxy.  It is a lower yellowing version of EPO-TEK® 301-2FL.

This is a two-component, room temperature curing epoxy featuring very low viscosity and excellent optical and mechanical properties. It is a lower viscosity version of EPO-TEK® 301.

A two-component, optical and semiconductor grade epoxy.  It is a verion of EPO-TEK® 301-2FL with enhanced flexibility and compressibility.

 A single-component, optical-grade, flexible epoxy resin; a thixotropic version of EPO-TEK® 301-2FL. 

A two-component version of EPO-TEK® 301-2 with added indicator for enhanced process control capabilities.

EPO-TEK® 301-104 is a single component, room temperature curing epoxy featuring very low viscosity, and excellent optical-mechanical properties.

EPO-TEK® 302-3M Black is a two-component room temperature curing epoxy used for optical, fiber optic, andsemiconductor applications. The system offers excellent joining, sealing, potting, and coating.

A two component, optically clear epoxy adhesive designed for optical, semiconductor and medical applications.Replacement for EPO-TEK® 310.

A version of EPO-TEK® 302-3M designed to meet European regulatory requirements. It is a two component epoxy used for optical, fiber optic, and semiconductor applications. The epoxy is good for adhesive joining, sealing, potting, or as a coating.

A two-component, flexible epoxy designed for low stress applications in semiconductor, hybrid, acoustical and optical industries.  Replacement for EPO-TEK® 310T.

A two-component, black-colored and optically opaque epoxy designed for optical, medical, and opto-electronic packaging of smiconductor devices and components.  It is a modification of EPO-TEK®320 for increased electrical insulation, higher Tg, and more viscous appearance.

A two component, optically opaque epoxy adhesive designed for semiconductor and PCB applications in optoelectronic instrumentation and assemblies. A lower viscosity version of EPO-TEK® 320 that can be poured, potted or cast intoshape.

Longer pot life version of EPO-TEK® 353ND designed for semiconductor, hybrid, fiber-optic, hard -disk drive and medical applications. This product meets halogen-free requirements.

Higher viscosity version of EPO-TEK® 375.  Designed for use in fiber optic applications.

EPO-TEK® 323LP-LH Ultra is a longer pot life version of EPO-TEK® 353ND designed for semiconductor, hybrid, fiber-optic, hard-disk drive and medical applications. This product easily meets halogen-free requirements.

This is a low halogen version of EPO-TEK® 330.  It is a two component, high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, and fiber optics applications.

This is a two component, high temperature epoxy designed for semiconductor, hybrid, and fiber optic applications.

A single component, electrically insulating epoxy designed as a low stress underfill adhesive for large die.  This is a more flowable modification of TD1001-67.

A white pigmented version of EPO-TEK® OD1001-67. It is a single component, electrically insulating epoxy designed as a low stress underfill adhesive for large die. It is also a more flowable version of EPO-TEK® TD1001-67.

This is a two component, high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, and fiber optics applications. It is a thixotropic paste for non-flow properties.

This is a two component, high temperature grade, electrically and thermally insulation epoxy.  It is a less thixotrop version of EPO-TEK® 360T.